1 oz Copper Immersion Gold Flexible Printed Circuit Board Double Sided FPC manufacturer from China LT CIRCUIT CO.,LTD .

1 oz Copper Immersion Gold Flexible Printed Circuit Board Double Sided FPC

Place of Origin:

Zhejiang, China (Mainland)


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1 oz Copper Immersion Gold Flexible Printed Circuit Board Double Sided FPC

1 oz Copper Immersion Gold Flexible Printed Circuit Board Double Sided FPC

Double sided flexible circuit (FPC) consists of double-sided copper clad material with top and bottom cover films (PI or Green/Yellow Oil, Carbon Ink, etc). Two

conductive layers with an insulating layer between, plus conver layers on outer layer. The cover films are pre-routed to access copper from both sides using plated thru

holes(PTH).

Our capability for FLEXIBLE PCB:

Item	Description	Common	Special
1	NO. OF Layer	1--6
2	FINISHED BOARD SIZE(MAX)	250*500mm	OK
3	FINISHED BOARD SIZE(MIN)	10*15mm	OK
4	BOARD THICKNESS(MAX)	0.016"(0.4mm)	OK
5	BOARD THICKNESS(MIN)	0.00328"(0.085)	OK
6	FINISHED BOARD THICKNESS FOLERANCE 0.085mmBoard Thickness0.4mm	±2mil(±0.05mm)	OK
7	DRILL HOLE DIAMETER(MAX)	0.236"(6.0mm)	OK
8	DRILL HOLE DIAMETER(MIN)	0.010"(0.25mm)	OK
9	For Machine Drill FINISHED VIA DIAMETER(MIN)	0.008"(0.2mm)	OK
10	OUTER LAYER BASE COPPER THICKNESS(MIN)	1/2OZ(0.01778mm)	OK
11	OUTER LAYER BASE COPPER THICKNESS(MAX)	1OZ(0.0355mm)	OK
12	INNER LAYER DIELECTRIC THICKNESS(MIN)	0,0127mm(1/2mil)	OK
13	INNER LAYER DIELECTRIC THICKNESS(MAX)	0.0254mm(1mil)	OK
14	BASE.MATERIAL	PI(260 TG)	OK
15	HOLE DIAMETER TOLERANCE(PTH)	±2mil(±0.05mm)	±1.5mil
16	HOLE DIAMETER TOLERANCE(NPTH)	±1mil(±0.025mm)	±1.5mil
17	HOLE POSITION TOLERANCE (COMPARED WITH CAD DATA)	±3mil(±0.076mm)	OK
18	PTH HOLE COPPER THICKNESS	0.5mil(0.0125mm)	OK
19	LAVER DESIGN LINE WIDTH/SPACING(MIN)	4mil/4mil(0.1016mm/0.1016mm)Multilayer 2.5mil/2.5mil(0.0635mm/0.06 35mm)Double side,single layer 0.5OZ	OK
20	TOLERANCE AFTER ETCHING	±20%(common)	±10% for impedance
21	IMAGE TO IMAGE TOLERANCE(MIN)	±5mil(±0.127mm) ±4mil	±3mil(0.076mm)
22	IMAGE TO EDGE TOLERANCE(MIN)	±4mil(±0.1mm)	OK
23	LEGEND MASK REGISTARTION(MIN)	±6mil(±0.15mm)	OK
24	SOLDERMASK REGISTARTION(MIN)	±6mil(±0.15mm)	OK
25	SOLDERMASK THICKNESS(MIN)	10UM	OK
26	CVL REFISTRATION(MIN)	8mil(4mil)	OK
27	CVLL Pressure and glue quantity (MIN)	5.6mil(2.4mil)	OK
28	SOLDER TIN LEAD THICKNESS ON FINGER OR PAD.(MAX) (MIN)AND TOLEARANCE THICKNESS	(1.0mil)(0.1mil) ±0.30mil	±0.15mil
29	GOLD FINGER NICKEL THICKNESS(MAX)	200u"±100u"	OK
30	SOLDER THICKNESS ON PADS(HAL)(MIN)	0.1mil	OK
31	NICKEL THICKNESS FOR ELECTROLESS NICKEL AND INMERSION GOLD(MEASLRED AT THE MINTMUM POINT)(MAX)	200u"±50u"/1-4u"	OK
32	SOLDER THICKNESS ON PADS (HAL)(MAX)	1.2mil	OK
33	SOLDERTHICKNESS ON PADS (HAL)(MIN)	0.1mil	OK
34	PUNCHING HOLE (MIN-MAX)DIAMETER TOLERANCE	0.5-6.0mm±0.05mm	OK
35	THE TOLERANCE OF PASTEING ADHESIVE AND STIFFER	±0.20mm	±0.10mil
36	PUNCHING DIE DIMENSION TOLERANCE (EDGE TO EDGE)(STEELDIE)Steel Die	±4mil(±0.1mm)	±2mil
37	PUNCHING DIE DIMENSION TOLERANCE (HOLE TO EDGE)(STEELDIE)Steel Die	±4mil(±0.1mm)	±2mil
38	PUNCHING DIE DIMENSION TOLERANCE (HOLE TO EDGE)(STEELDIE)cutting die	±8mil(±0.2mm)	±6mil