BGA Multilayer PCB Board with Stamp Holes / Vias , 6 Layer PWB manufacturer from China LT CIRCUIT CO.,LTD .

BGA Multilayer PCB Board with Stamp Holes / Vias , 6 Layer PWB

Place of Origin:

Zhejiang, China (Mainland)


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BGA Multilayer PCB Board with Stamp Holes / Vias , 6 Layer PWB

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BGA Multilayer PCB Board with Stamp Holes / Vias , 6 Layer PWB

Number. of Layers:	6
Laminate Material:	FR4
Surface Finish:	ENIG
Copper Thickness:	1 OZ COPPER
Board Thickness:	1.6mm (0.062”)
Board Size:
Color of Mask:	Green
Color of Silkscreen:	White with Non-Conductive Ink
Flammability:	UL 94V-0
Workmanship:	Compliance with IPC-A-600 & IPC-6012 CLASS II
Thermal Conductivity	-

Capacity

		High precision prototype	PCB bulk production
Max Layers		1-28 layers	1-14 layers
MIN Line width(mil)		3mil	4mil
MIN Line space(mil)		3mil	4mil
Min via (mechanical drilling)	Board thickness≤1.2mm	0.15mm	0.2mm
	Board thickness≤2.5mm	0.2mm	0.3mm
	Board thickness2.5mm	Aspect Ration≤13:1	Aspect Ration≤13:1
Aspect Ration		Aspect Ration≤13:1	Aspect Ration≤13:1
Board thickness	MAX	8mm	7mm
Board thickness	MIN	2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm	2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm
MAX Board size		610*1200mm	610*1200mm
Max copper thickness		0.5-6oz	0.5-6oz
Immersion Gold/ Gold Plated Thickness		Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u”
Hole copper thick		25um 1mil	25um 1mil
Tolerance	Board thickness	Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8%	Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8%
	Outline Tolerance	≤100mm:+/-0.1mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm	≤100mm:+/-0.13mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm
	Impedance	±10%	±10%
MIN Solder mask bridge		0.08mm	0.10mm
Plugging Vias capability		0.25mm--0.60mm	0.70mm--1.00mm

1. Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design.

2. Material Type: FR4, non-halogen material, Aluminum Base, Cooper Base, high frequency material, Thick copper foil, 94-V0(HB), PI Material; HIGH TG: SL S1000-2; ITEQ: IT180

3. Surface Finish: HASL, Immersion Gold, Immersion Tin, Immersion silver, Gold Finger, OSP, HASL (Immersion Gold, OSP, Immersion silver, Immersion Tin) + Gold Finger

Advantage

1. Factory directly
2. Comprehensive quality control system

3. Competitive price
4. Quick turn: delivery time from 48hours.
5. Certification (ISO/UL E354810/ RoHS)

6. 8 years experience in exporting service

7. No MOQ/MOV.

8. High quality. Strict through the AOI (Automated Optical Inspection), QA/QC, flying probe, E-testing, etc.